By Kash L. Mittal
This publication files the court cases of the second one overseas Symposium on Adhesion size of flicks and Coatings, held in Newark, NJ, October 25-27, 1999. This quantity comprises 20 papers, that have all been carefully peer reviewed and certainly changed prior to inclusion. the themes contain: dimension and research of interface adhesion; relative adhesion size for skinny movie buildings; adhesion checking out of demanding coatings through a number of concepts; dimension of interfacial fracture strength in multifilm functions; laser brought about decohesion spectroscopy (LIDS) for measuring adhesion; pulsed laser strategy for overview of adhesion; blade adhesion attempt; JKR adhesion attempt; coefficient of thermal growth size; and residual stresses in diamond motion pictures.
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Extra info for Adhesion Measurement of Films and Coatings, Volume 2
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The cracks in the residual PI are perpendicular to the main peel crack path as well as perpendicular to the peel direction, which is marked in the figure. Relative adhesion measurement for thin film microelectronic structures 31 RESIDUAL P I PHASE LAYER Figure 10. Cross-sectional SEM analysis of peeled metal film from a Cu/phase layer (adhesion promoting 1ayer)lTiWIPI test sample. Note the secondary cracking (crack branching) extending through the more brittle metal films and blunting into the more ductile Cu .
A schematic of MELT specimen with release layer for initial crack definition. The top view of the sample after successful dicing along the middle of the 5mm wide release layer strips is shown in Figure 18. This type of sample fulfills the steady-state requirement for crack propagation (pre-crack length should be -5 x film thickness) . The rest of the paper will focus on low-k ILD/Si02 MELT results (Modern Metalcraft Cryostage MELT equipment) and locus of failure characterization. 75ym. The epoxy thickness was on the order of 200pm.